CBRHD-04 TR13 PBFREE

CBRHD SERIES SURFACE MOUNT SILICON HIGH DENSITY 0.5 AMP BRIDGE RECTIFIER w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CBRHD series devices are silicon full wave bridge rectifiers mounted in a durable epoxy surface mount molded case, utilizing glass passivated chips. MARKING CODES: CBRHD-02: CBD2 CBRHD-06: CBD6 CBRHD-04: CBD4 CBRHD-10: CBD10 HD DIP CASE FEATURES: • Efficient use of board space: requires only 42mm2 of board space vs. 120mm2 of board space needed for industry standard 1.0 Amp surface mount bridge rectifier. • 50% higher density (Amps/mm2) than the industry standard 1.0 Amp surface mount bridge rectifier. • Glass passivated chips for high reliability. MAXIMUM RATINGS: (TA=25°C unless otherwise noted) SYMBOL Peak Repetitive Reverse Voltage VRRM DC Blocking Voltage VR -02 200 CBRHD -04 -06 400 600 -10* 1000 UNITS V 200 400 600 1000 V RMS Reverse Voltage 140 280 420 700 Average Forward Current (TA=40°C) (Note 1) Average Forward Current (TA=40°C) (Note 2) Peak Forward Surge Current Operating & Storage Junction Temperature VR(RMS) IO IO IFSM TJ, Tstg A 0.8 A 30 -65 to +150 ELECTRICAL CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS TYP MAX IR VR=Rated VRRM 5.0 IR VR=Rated VRRM, TA=125°C 500 VF CJ IF=400mA VR=4.0V, f=1.0MHz 1.0 20 V 0.5 A °C UNITS µA µA V pF Notes: (1) Mounted on Glass-Epoxy PCB. (2) Mounted on Ceramic PCB. * Available on special order, please consult factory. R6 (19-August 2020) CBRHD SERIES SURFACE MOUNT SILICON HIGH DENSITY 0.5 AMP BRIDGE RECTIFIER HD DIP CASE - MECHANICAL OUTLINE MARKING CODES: CBRHD-02: CBD2 CBRHD-04: CBD4 CBRHD-06: CBD6 CBRHD-10: CBD10 SYMBOL A B C D E F G H J K L DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0.006 0.014 0.15 0.35 0.275 7.00 0.027 0.043 0.70 1.10 0.035 0.051 0.90 1.30 0.090 0.106 2.30 2.70 0.019 0.031 0.50 0.80 0.146 0.165 3.70 4.20 0.051 0.067 1.30 1.70 0.177 0.193 4.50 4.90 0.090 0.106 2.30 2.70 0.000 0.008 0.00 0.20 HD DIP (REV: R3) R6 (19-August 2020) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)